無錫自動(dòng)化高速激光劃片裂片機(jī)客戶現(xiàn)場溫馨提示：同這款機(jī)型有可能有多款子機(jī)型，各子機(jī)型相關(guān)配置不一，客戶也可能有個(gè)性化的需求，所以無法對(duì)產(chǎn)品進(jìn)行標(biāo)價(jià)，網(wǎng)上的價(jià)格都為虛價(jià)，如需一體的機(jī)型介紹，機(jī)型報(bào)價(jià)，或者需要有經(jīng)驗(yàn)的技術(shù)咨詢，請(qǐng)聯(lián)系我。設(shè)備性能特點(diǎn)1、的劃片工藝 采用光纖激光器，光束質(zhì)量好，激光劃線寬度細(xì)；電池片切割斷面更整齊，切割準(zhǔn)確 2、工作效率高激光劃片速度快，設(shè)備產(chǎn)能可達(dá)1800整片/小時(shí)以上。 3、精度定位電池片全自動(dòng)定位，定位誤差≤±0.1mm 4、自動(dòng)化程度高 電池片自動(dòng)上下料、自動(dòng)定位、自動(dòng)劃片、自動(dòng)裝盒。性能穩(wěn)定，故障率低，維護(hù)簡單。 5、產(chǎn)能高設(shè)備升級(jí)換代，一臺(tái)抵5臺(tái)老、有效提高產(chǎn)能、減少人工。 6、成本低設(shè)備、性價(jià)比高，自動(dòng)化程度高。Equipment IntroductionIt is suitable for automatic scribing and splitting of solar cells made of monocrystalline silicon and polycrystalline silicon materials, and can complete the functions of automatic feeding, automatic positioning scribing, automatic splitting, automatic packing of small wafers, etc.Meanwhile we can provide specified models for scribing but non-splitting of different sizes as required. Equipment Feature Advanced scribing technology:Adopt fiber laser source, good quality laser beam, slim laser scribing line, more uniform solar cell cutting surface, small damage to solar cell, high accuracy cutting. High efficiencyHigh laser scribing speed, producing capacity can reach to 1800 full cells/hour Accuracy positioningSolar cell full automatic positioning, positioning accuracy ≤±0.1mm High automation levelSolar cell automatic loading and unloading, automatic positioning, automatic scribing.Stable performance, low failure rate, easy maintenance.